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Delivery of New Fibre & Micro-Optics Packaging Machine at Tyndall National Institute, supported by OIP4NWE project

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Tyndall National Institute - photonics packaging group has become the world’s best-in-class reference for integrated photonic packaging, through the various research projects over the years the photonics packaging team is developing the packaging building blocks to help standardise the packaging process which account up to 60% of the costs of photonic integrated devices. Read More